indus t rial po wer c o ntrol diod e silicon carbide schottky diode final da ta sh eet rev. 2.0 , 2015 - 06 - 22 id m02g 120c5 5 th generation thinq!? 1200 v sic schottky diode
1) j - std20 and jesd22 final data sheet 2 rev. 2.0 , 20 15 - 06 - 22 5 th generation thinq!? 1200 v sic schottky diode idm02 g120c5 sic schottky diode features : ? revolutionary semiconductor material - silicon carbide ? no reverse recovery current / no forward recovery ? temperature independent switching behavior ? low forward voltage even at high operating temperature ? tight forwa rd voltage distribution ? excellent thermal performance ? extended surge current capability ? specified dv/dt ruggedness ? qualified according to jedec 1) for target applications ? pb - free lead plating; rohs compliant benefits ? system efficiency improvement o ver si diodes ? enabling higher frequency / increased power density solutions ? system size /cost savings due to reduced heatsink requirements and smaller magnetics ? reduced emi ? highest efficiency across the entire load range ? robust diode operation during surge events ? high reliability ? relatedlinks: www.infineon.com/sic applications ? solar inverters ? u ninterruptable power supplies ? m otor drives ? power factor correction package pin definitions ? pin 1 and backside C cathod e ? pin 2 C anode key performance and package parameter s type v dc i f q c t j,max marking package id m0 2 g120c5 1200v 2 a 1 4 nc 175c d 0 2 12 c 5 pg - to 252 - 2 1 2
final data sheet 3 rev. 2.0 , 2015 - 06 - 22 5 th generation thinq!? 1200 v sic schottky diode idm02 g120c5 table of contents description. ................................ ................................ ................................ ................................ ............. 2 table of contents ................................ ................................ ................................ ................................ ........ 3 maximum ratings ................................ ................................ ................................ ................................ ......... 4 thermal resistances ................................ ................................ ................................ ................................ .. 4 electrical characteristics ................................ ................................ ................................ ............................. 5 electrical characteristics diagram ................................ ................................ ................................ .............. 5 package draw ings ................................ ................................ ................................ ................................ ...... 9 revision history ................................ ................................ ................................ ................................ ........ 10 disclaimer . ................................ ................................ ................................ ................................ ............. 10
final data sheet 4 rev. 2.0 , 2015 - 06 - 22 5 th generation thinq!? 1200 v sic schottky diode idm02 g120c5 maximum ratings parameter symbol value unit repetiti ve peak reverse voltage v rrm 1200 v continoues forward current for r th(j - c,max) t c = 1 70 c, d=1 t c = 135c, d=1 t c = 25c, d=1 i f 2 7 14 a surge non - repetitive forward current, sine halfwave t c =25c, t p =10ms t c =150c, t p =10ms i f,sm 37 31 non - repetit ive peak forward current t c = 2 5 c, t p =10 s i f,max 344 i2t value t c = 25c, t p =10 ms t c = 150c, t p =10 ms i2dt 7.0 4.9 a2s diode d v /d t ruggedness v r =0. . .960 v d v /d t 80 v/ns power dissipation t c = 25c p tot 98 w operating and storage temperature t j ;t stg - 55 175 c soldering temperature, wave - and reflow soldering allowed (reflow msl1) t sold 260 the rmal resistances parameter symbol conditions value unit min. typ. max. characteristic diode thermal resistance, junction C case r th(j - c) - 1. 2 1. 5 k/w thermal resistance, junction C ambient r th(j - a) smd version, device on pcb, minimal footprint - - 62 smd version, device on pcb, 6 cm2 cooling area 2 ) 35 2 ) device on 40 mm*40mm*1.5 epoxy pcb fr4 with 6cm2 (one layer, 70m thick) copper for cathode connection. pcb is vertical without air stream cooling.
final data sheet 5 rev. 2.0 , 2015 - 06 - 22 5 th generation thinq!? 1200 v sic schottky diode idm02 g120c5 electrical characteristics , at t j =25c, unless otherwise specified parameter symbol conditions value unit min. typ. max. static characteristic dc blocking voltage v dc t j = 25c 1200 - - v diode forward voltage v f i f = 2 a, t j =25c i f = 2 a, t j =150c - - 1.4 1. 7 1.65 2 . 30 v revers e current i r v r =1200 v, t j =25c v r =1200 v, t j =150c 1.2 6 18 9 0 a ac characteristics, at t j =25c, unless otherwise specified parameter symbol conditions value unit min. typ. max. dynamic characteristics total capacitive charge q c v r = 8 00 v , t j =150c - 14 - nc total capacitance c v r =1 v, f =1 mhz v r =400 v, f =1 mhz v r =800 v, f =1 mhz - - - 182 13 1 0 - - - pf electrical characteristics diagram ? ? r v c dv v c q 0 ) (
final data sheet 6 rev. 2.0 , 2015 - 06 - 22 5 th generation thinq!? 1200 v sic schottky diode idm02 g120c5 figure 1 . power dissipation as a function of case temperature, p tot =f( t c ), r th(j - c),max figure 2 . diode forward current as function of temperature , t j 175c, r th(j - c),max , parameter d =duty cycle, v th , r diff @ t j =175c figure 3 . typical forward characteristics , i f =f( v f ), t p = 10 s, parameter: t j figure 4 . typical forward characteristic s in surge current , i f =f( v f ) , t p = 10 s , parameter: t j
final data sheet 7 rev. 2.0 , 2015 - 06 - 22 5 th generation thinq!? 1200 v sic schottky diode idm02 g120c5 figure 5 . typical capacitance charge as function of current slope 1 , q c =f( di f / dt ), t j = 150c 1) only capacitive charge, guaranteed by design. figure 6 . typical reverse current as function of reverse voltage, i r =f( v r ), parameter: t j figure 7 . m ax. tran sient thermal impedance , z th,jc =f( t p ) , parameter: d= t p / t figure 8 . typical capacitance as function of reverse voltage , c= f( v r ); t j =25 c; f =1 mhz
final data sheet 8 rev. 2.0 , 2015 - 06 - 22 5 th generation thinq!? 1200 v sic schottky diode idm02 g120c5 figure 9 . typical ca pacitance stored energy as function of reverse voltage , ? ? r v c vdv v c e 0 ) (
final data sheet 9 rev. 2.0 , 2015 - 06 - 22 5 th generation thinq!? 1200 v sic schottky diode idm02 g120c5 pg - to252 - 2 package drawings
final data sheet 10 rev. 2.0 , 2015 - 06 - 22 5 th generation thinq!? 1200 v sic schottky diode idm02 g120c5 revision history disclaimer we listen to your comments any information within this document that you feel is wrong, unclear or missing at all? your feedback will help us to continuously improve the quali ty of this document. please send your proposal (including a reference to this document) to: erratum@infineon.com published by infineon technologies ag 81726 munich, germany ? 201 5 infineon technologies ag all rights reserved. legal disclaimer the infor mation given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device , infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non - infringement of intellectual property rights of any third party. information for further information on technology , delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for inform ation on the types in question, please contact the nearest infineon technologies office. the infineon technologies component described in this data sheet may be used in life - support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life - support, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the use r or other persons may be endangered. iid m0 2 g120c5 revision: 201 5 - 06 - 22, rev. 2 .0 previous revision: revision date subjects (ma jor changes since last version) 2 .0 2015 - 06 - 22 final data sheet
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